Title:
THERMAL CONDUCTIVE GREASE
Document Type and Number:
Japanese Patent JP3957596
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide thermal conductive grease having high thermal conductivity, thin and suitable for a heat radiating material of exothermic electronic parts.
SOLUTION: The thermal conductive grease comprises 15-35 mass% organopolysiloxane, 35-55 mass% spherical alumina powder having ≥0.2 to <1.0 μm average particle size and 30-50 mass% aluminum nitride powder having 2-10 μm maximum particle size and further includes≤2 mass% (without including 0) thickener.
Inventors:
Hiroaki Sawa
Toshikatsu Mitsunaga
Kawano Masato
Masahide Kaneko
Toshikatsu Mitsunaga
Kawano Masato
Masahide Kaneko
Application Number:
JP2002258383A
Publication Date:
August 15, 2007
Filing Date:
September 04, 2002
Export Citation:
Assignee:
DENKI KAGAKU KOGYO KABUSHIKI KAISHA
International Classes:
C08L83/04; C10M169/02; C08K3/22; C08K3/28; C08K7/18; C08L1/28; C08L23/20; C08L91/00; C08L93/00; C10M105/76; C10M107/50; C10M119/04; C10M119/12; C10M119/20; C10M125/10; C10M125/20; C10N20/06; C10N30/06; C10N30/08; C10N40/06; C10N50/10; (IPC1-7): C10M169/02; C10M105/76; C10M107/50; C10M119/04; C10M119/12; C10M119/20; C10M125/10; C10M125/20; //C10N20:06; C10N30:06; C10N30:08; C10N40:06; C10N50:10
Domestic Patent References:
| JP2000169873A | ||||
| JP2000109373A | ||||
| JP200063872A | ||||
| JP11307700A | ||||
| JP9100394A | ||||
| JP6330071A |