Title:
熱伝導性湿気硬化型樹脂組成物およびその硬化物
Document Type and Number:
Japanese Patent JP7277796
Kind Code:
B2
Abstract:
The purpose of the present invention is to provide a thermally conductive moisture-curable resin composition which develops excellent thermal conductivity and peelability after curing.The thermally conductive moisture-curable resin composition contains the following components (A) to (C):component (A): an organic polymer containing two or more hydrolyzable silyl groups;component (B): a thermally conductive filler; andcomponent (C): a silicone compound having a polar group and/or a polar chain at a terminal or a side chain.
Inventors:
Kentaro Watanabe
Application Number:
JP2020500412A
Publication Date:
May 19, 2023
Filing Date:
February 05, 2019
Export Citation:
Assignee:
ThreeBond Co., Ltd.
International Classes:
C08L71/00; C08K3/22; C08K3/28; C08L83/04; C09J171/00; C09J183/00
Domestic Patent References:
| JP4093359A | ||||
| JP2008504407A | ||||
| JP2010209205A | ||||
| JP2004018695A | ||||
| JP3210367A | ||||
| JP2238045A | ||||
| JP59025837A | ||||
| JP2007262140A | ||||
| JP2010533236A | ||||
| JP2016210832A |
Foreign References:
| WO2011089987A1 |
Attorney, Agent or Firm:
IBC Ichibancho Patent Attorney Corporation