Title:
THERMAL CONDUCTIVE SHEET AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2011054705
Kind Code:
A
Abstract:
To provide a low-cost thermal conductive sheet having high thermal conductivity and high heat resistance properties.
The thermal conductive sheet includes a thermal conductive resin layer, where a blend ratio of a thermal conductive filler to a thermoplastic resin is 10-90: 90-10 on a volume ratio, wherein the thermal conductive resin layer is a thermoplastic crosslinking type resin and crosslinking is performed by applying electron rays. The thermoplastic crosslinking type resin is an ethylene-acrylate-maleic anhydride copolymer, and a thermal shrinkage ratio is not more than 5%.
Inventors:
YAGI IZUMI
UEKI TAKAYUKI
KUROKI JUNICHI
TAGUCHI TOMOHIRO
UEKI TAKAYUKI
KUROKI JUNICHI
TAGUCHI TOMOHIRO
Application Number:
JP2009201391A
Publication Date:
March 17, 2011
Filing Date:
September 01, 2009
Export Citation:
Assignee:
DAINIPPON PRINTING CO LTD
International Classes:
H05K7/20; C08J7/00; C08K3/00; C08L23/08; H01L23/36; H01L23/373
Attorney, Agent or Firm:
Satoshi Kanayama
Keiko Fukamachi
Hideo Ito
Hiromi Fujimasu
Naoki Goto
Keiko Fukamachi
Hideo Ito
Hiromi Fujimasu
Naoki Goto
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