Title:
熱伝導性シリコーン組成物及び熱伝導性シリコーン材料
Document Type and Number:
Japanese Patent JP7390548
Kind Code:
B2
Abstract:
A thermally conductive silicone composition contains a silicone component and a polyhedral filler.
Inventors:
Hiroshi Yamamoto
Keiichi Komatsu
Keiichi Komatsu
Application Number:
JP2019162412A
Publication Date:
December 04, 2023
Filing Date:
September 05, 2019
Export Citation:
Assignee:
Panasonic IP Management Co., Ltd.
International Classes:
C08L83/04; C08K3/01; C09K5/10
Domestic Patent References:
| JP2018050018A | ||||
| JP2019210305A | ||||
| JP2020073626A |
Foreign References:
| WO2018016566A1 |
Attorney, Agent or Firm:
Hokuto Patent Attorneys Office
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