Title:
THERMAL CONDUCTIVITY COMPOSITION
Document Type and Number:
Japanese Patent JP2021008548
Kind Code:
A
Abstract:
To provide a thermal conductivity composition having excellent pump-out resistance.SOLUTION: A thermal conductivity composition containing at least a thermal conductivity filler, a base oil, and a dispersant and having excellent pump-out resistance, in which when the thermal conductivity composition is coated so as to be a thickness of 100 μm on a base material, and is heated at 250°C, for 4 hours, a difference (T1-T2) between a vaporization start temperature T1 in a thermal differential analysis in air before the heat treatment, and a vaporization start temperature T2 by thermal differential analysis in air after the heat treatment is 20°C or smaller.SELECTED DRAWING: None
Inventors:
HANZAWA KAZUKI
KOBAYASHI HIROSHI
KIBE TATSUO
KASHIWATANI SATOSHI
KOBAYASHI HIROSHI
KIBE TATSUO
KASHIWATANI SATOSHI
Application Number:
JP2019122217A
Publication Date:
January 28, 2021
Filing Date:
June 28, 2019
Export Citation:
Assignee:
SUMITOMO METAL MINING CO
International Classes:
C09K5/14; C08K3/01
Attorney, Agent or Firm:
Masayuki Masabayashi
Hayashi Ichiyoshi
Hayashi Ichiyoshi