Title:
熱伝導率制御体
Document Type and Number:
Japanese Patent JP7354689
Kind Code:
B2
Abstract:
To provide a thermal conductivity control body capable of changing a thermal conductivity according to temperature.SOLUTION: A thermal conductivity control body of the invention includes at least two thermally conductive material plates laminated with a separation layer interposed therebetween. The two thermally conductive material plates are held so that they can be changed from a separation state to a contact state and from the contact state to the separation state. A bimetal plate is disposed opposite to the thermally conductive material plates on an upper side of an uppermost part or on a lower side of a downmost part in a laminate direction of the thermally conductive material plates.SELECTED DRAWING: Figure 1
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Inventors:
Hiroyuki Suzuki
Ai Okano
Ai Okano
Application Number:
JP2019156211A
Publication Date:
October 03, 2023
Filing Date:
August 28, 2019
Export Citation:
Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
F28D19/04; B32B7/027; B32B15/01
Domestic Patent References:
| JP7239089A | ||||
| JP2019125701A | ||||
| JP2013243365A | ||||
| JP2018132193A |
Foreign References:
| WO2018151198A1 |
Attorney, Agent or Firm:
Hiromi Fujimasu
Keiko Fukamachi
Hideo Ito
Naoki Goto
Hideyuki Tateishi
Keiko Fukamachi
Hideo Ito
Naoki Goto
Hideyuki Tateishi
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