Title:
THERMAL HEAD AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JP3240366
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To attempt the high grade recording action by reducing the thermally mutual interference between heating resistors adjacent to each other and, during the recording action, realize the reduction of consuming electric power and a small-sized and lightweight thermal head.
SOLUTION: Both end parts of a buckling heating element 4 as a heating resistor are fixed through insulating members 3 and 3 on a board 2. When the buckling heating element 4 is thermally expanded from its substantially thermal stress-free no displacement state by being heated up to a predetermined temperature or higher necessary for buckling the buckling heating element under the state that the buckling heating element 4 is controlled by being energized with a power source 6 by means of a switch 5, the thermal expansion of the buckling heat element is suppressed due to the fixing of its both end parts, resulting in exceeding the compression force accumulated within it over its buckling load so as to deform it to a heat-sensitive paper 7 side by buckling.
Inventors:
Koji Matoba
Susumu Hirata
Yorinari Ishii
Shingo Abe
Hiroshi Onda
Tetsuya Inui
Susumu Hirata
Yorinari Ishii
Shingo Abe
Hiroshi Onda
Tetsuya Inui
Application Number:
JP27916095A
Publication Date:
December 17, 2001
Filing Date:
October 26, 1995
Export Citation:
Assignee:
Sharp Corporation
International Classes:
B41J2/335; (IPC1-7): B41J2/335
Domestic Patent References:
| JP7256880A |
Attorney, Agent or Firm:
Kazuhide Okada
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