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Title:
THERMAL HEAD, PRINTER AND MANUFACTURING METHOD FOR THERMAL HEAD
Document Type and Number:
Japanese Patent JP2014000727
Kind Code:
A
Abstract:

To exhibit uniform and sufficient insulation effectiveness and suppress heat radiation to a support substrate while keeping print quality.

A thermal head 10 comprises: a support substrate 12; an upper plate substrate 14 placed on one surface side of the support substrate 12 in lamination state; a middle layer 13 that is placed between the support substrate 12 and the upper plate substrate 14 and is jointed to the support substrate 12 and the upper plate substrate 14 and has a penetration hole 13a forming a cavity part 23 between the upper plate substrate 14 and the support substrate 12; and a heat resistive element 15 formed at a position facing the cavity part 23 on a surface opposite to the support substrate 12 on the upper plate substrate 14, wherein the upper plate substrate 14 has a lower melting point than the melting point of the middle layer 13.


Inventors:
SANHONGI NORIMITSU
KOROISHI KEITARO
MOROOKA TOSHIMITSU
Application Number:
JP2012137796A
Publication Date:
January 09, 2014
Filing Date:
June 19, 2012
Export Citation:
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Assignee:
SEIKO INSTR INC
International Classes:
B41J2/335
Domestic Patent References:
JP2007083532A2007-04-05
JP2009119850A2009-06-04
JP2010125750A2010-06-10
JP2001205837A2001-07-31
JPH07323592A1995-12-12
JP2007083532A2007-04-05
JP2009119850A2009-06-04
Attorney, Agent or Firm:
Kunio Ueda
Noriharu Fujita



 
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