Title:
THERMAL HEAD
Document Type and Number:
Japanese Patent JPH05185629
Kind Code:
A
Abstract:
PURPOSE: To obtain a thermal head protecting wire bonding from external force or heat stress and dispensing with a protective cover.
CONSTITUTION: A heating part 2 and a circuit part 3 are provided on a support 1 to be electrically connected by wire bonding and the first protective layer 5 composed of a soft resin covering the wire bonding 4 is provided so as to be stretched between both of the heating part 2 and the circuit part 3 and the second protective layer 6 composed of a hard resin covering a part of the first protective layer 5 is in contact with either one of the heating part 2 and the circuit part 3.
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Inventors:
KOYAMA TAIICHI
MIYAZAKI KAZUYOSHI
ATSUMI TOMOO
IWAKAWA HIROFUMI
MIYAZAKI KAZUYOSHI
ATSUMI TOMOO
IWAKAWA HIROFUMI
Application Number:
JP240892A
Publication Date:
July 27, 1993
Filing Date:
January 09, 1992
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
B41J2/335; (IPC1-7): B41J2/335
Attorney, Agent or Firm:
Taketoshi Mototoshi