PURPOSE: To make it possible to form accurate pattern edge to improve the yield rate of products, and to decrease the costs, in the thin film type thermal head, by constituting an electrode pattern by a multiple structure comprising a chromium layer, a copper layer, and metal.

CONSTITUTION: On a ceramic substate 4, a tantalum nitride layer 5 with a thickness of about 2,500 is formed by a sputtering method. On the tantalum nitride layer 5, the chromium layer 12 with a thickness of about 1,500 is formed by an evaporating method. The copper layer 13 with the thickness of about 6,000 is formed by the evaporating method. The copper layer 14 with a thickness of about 1μm is formed on said copper layer 13 by a galvanizing method. Finally the metal 8 with the thickness of about 2,000 is formed on the copper plated layer 14 by a galvanizing method. Then, a photoresist layer is applied on the metal 8, and a photoresist pattern15 is formed. With this pattern as a mask, etching is sequentially performed on the multiple electrode layers from the top, and the electrode pattern is formed. The tantalum nitride layer 5 is further etched and the heating resistor body pattern is formed, and an oxidation preventing layer 9 comprising silicon dioxide and an abrasion resisting layer 10 comprising tantalum pentoxide are formed.