Title:
THERMAL INTERFACE ADHESIVE AND REPROCESSING
Document Type and Number:
Japanese Patent JP2005325348
Kind Code:
A
Abstract:
To provide a conductive adhesive composition so as to be capable of reuse of parts.
An epoxy based conductive adhesive contains conductive metal filler particles dispersed in a solventless hybrid epoxy polymer matrix and its production method are given. In an additional embodiment, an improved removal method of the cured conductive polymer adhesive disclosed as a thermal interface material from electronic parts for reuse or recovery of reusable parts such as an expensive semiconductor element, a heat sink and other module parts is provided.
Inventors:
SACHDEV KRISHNA G
BERGER DANIEL G
CHIOUJONES KELLY M
DAVES GLENN G
TOY HILTON T
BERGER DANIEL G
CHIOUJONES KELLY M
DAVES GLENN G
TOY HILTON T
Application Number:
JP2005119145A
Publication Date:
November 24, 2005
Filing Date:
April 18, 2005
Export Citation:
Assignee:
IBM
International Classes:
C09D9/00; C08K3/08; C09J9/02; C09J11/04; C09J163/00; C09J183/06; H01B1/00; H01B1/22; H01B1/24; H01L23/373; H01L23/42; H01L23/433; H05K3/32; (IPC1-7): C09J163/00; C09D9/00; C09J9/02; C09J11/04; C09J183/06; H01B1/00; H01B1/22; H01B1/24; H01L23/373
Attorney, Agent or Firm:
Hiroshi Sakaguchi
Yoshihiro City
Takeshi Ueno
Yoshihiro City
Takeshi Ueno