Title:
THERMAL OVERLOAD RELAY
Document Type and Number:
Japanese Patent JP2004172122
Kind Code:
A
Abstract:
To provide a thermal overload relay achieving small size by horizontally arranging a main bimetal and a heater of an actuator part to lower the height of the the actuator part.
The thermal overload relay comprises a plurality of main bimetals 22 which are arranged in horizontal direction parallel to the bottom surface of a case 21, and bent in horizontal direction in case of circuit abnormality, a heater for bending the main bimetal, a shifter (24, 25) which is arranged abutting one end part of the main bimetal and is movable in horizontal direction by the bending of the main bimetal, and a lever 26 connected to the shifter to transmit horizontal power of the shifter to a switching mechanism part.
Inventors:
LEE KYUNG KU
Application Number:
JP2003385263A
Publication Date:
June 17, 2004
Filing Date:
November 14, 2003
Export Citation:
Assignee:
LG IND SYST CO LTD
International Classes:
H01H61/00; H01H61/01; H01H61/02; H01H71/16; H01H83/22; H01H71/02; (IPC1-7): H01H61/01; H01H61/02
Attorney, Agent or Firm:
Atsushi Aoki
Jun Tsuruta
Tetsuro Shimada
Kenzo Hiraiwa
Masaya Nishiyama
Jun Tsuruta
Tetsuro Shimada
Kenzo Hiraiwa
Masaya Nishiyama
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