Title:
THERMAL OVERLOAD RELAY
Document Type and Number:
Japanese Patent JPH0982200
Kind Code:
A
Abstract:
To enhance the performance of an indirectly heated thermal overload relay in transferring heat from a heater to a bimetal.
A heat-transfer plate 8 is provided which bridges a part of the portion between a heater 1 and a bimetal 6 placed parallelly to the heater with a gap between them. The heat of the heater 1 is therefore imparted to the bimetal 6 by heat transfer via the gap and also by heat conduction through the plate 8, resulting in enhanced heat-transfer performance and the amount and speed of curving of the bimetal 6 are increased.
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Inventors:
OOGAMI TOSHIKATSU
Application Number:
JP25941095A
Publication Date:
March 28, 1997
Filing Date:
September 12, 1995
Export Citation:
Assignee:
FUJI ELECTRIC CO LTD
International Classes:
H01H61/02; H01H73/22; H01H71/16; (IPC1-7): H01H61/02; H01H73/22
Attorney, Agent or Firm:
Yoshihide Komada
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