Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
THERMAL PRESSURE CONNECTION MEMBER AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JPH06150996
Kind Code:
A
Abstract:

PURPOSE: To manufacture a thermal pressure connection connecting member used to connect connecting terminals of a display body and a circuit board mounted with the driving portion or to connect boards of various electric circuits.

CONSTITUTION: A thermal pressure connection member is provided with a flexible base material 1, grains 2a fitted at the portion where at least a conduction line pattern 4 is to be formed on the flexible base material 1 via an insulating organic polymer material 3 serving as a binder, a the conduction pattern 4 printed with conduction paste on the grains 2a, and an insulating adhesive layer 5 formed on at least the connection section with a connected circuit board on the conduction line pattern 4. In this manufacture, the grains 2a are fixed by the insulation organic polymer material 3, the conduction paste is printed from above by screen printing to form the conduction pattern 4, then the insulation adhesive layer 5 is formed at least at the connection section with a connected circuit board on the conduction line pattern 4.


Inventors:
YOSHIDA KAZUYOSHI
Application Number:
JP31600792A
Publication Date:
May 31, 1994
Filing Date:
October 30, 1992
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SHINETSU POLYMER CO
International Classes:
H01B1/20; H01R4/04; H01R11/01; H01R43/00; H05K3/32; H05K3/36; (IPC1-7): H01R11/01; H01B1/20; H01R4/04; H01R43/00
Domestic Patent References:
JPS63190268A1988-08-05
JPH03119676A1991-05-22
JPS61195568A1986-08-29
JPS6174205A1986-04-16
Attorney, Agent or Firm:
Ryoichi Yamamoto (1 person outside)