PURPOSE: To enhance capability of manufacturing a heating substrate and facilitate designing of a device using a thermal printing head, by a construction wherein a driving substrate comprises a bent part provided with a driving IC at one end thereof, a resin is provided in the gap between a heating substrate and the other end of the driving substrate, and wires for electrically connecting a plurality of heating resistors to the driving IC are provided on the resin.

CONSTITUTION: One end part of the driving substrate 34 formed of a flexible material is bent substantially perpendicularly with a bending point 46 as a center, and the bent part 3401 is provided with the driving IC2 and driving wires 5 required for driving the IC2. A resin 39 such as a silicone resin is packed in the gap between the heating substrate 31 and the driving substrate 34. Since the bent part 3401 is substantially perpendicularly formed, the size of the thermal printing head is reduced. In addition, since the heating substrate 31 is placed in a recessed part 37 of the driving substrate 34, the other surface of the driving substrate 34 and the surface of the heating substrate 31 become substantially flush with each other.