Title:
THERMAL PROCESSOR
Document Type and Number:
Japanese Patent JP2001208478
Kind Code:
A
Abstract:
To enable a heater element to be partially displaced in a vertical thermal processor capable of processing a semiconductor wafer in a batch, and to enhance uniformity of processing atmosphere with suppression of heat dissipation from the end of the heater element.
A longitudinal heater element comprising a carbon wire sealed inside a U-shaped unit is used constitute a set of continuous waveform, for example, at six divisions along an inner peripheral surface of cylinder. Both ends of the divided heater elements are placed remotely in the peripheral direction, and these ends are declined so as to extend in parallel each other and to be lower in their outer sides to pass through peripheral wall of the cylinder for taking out lead terminal.
Inventors:
SAITO TAKANORI
KADOBE MASAHITO
TAKIZAWA TAKESHI
KADOBE MASAHITO
TAKIZAWA TAKESHI
Application Number:
JP2000021346A
Publication Date:
August 03, 2001
Filing Date:
January 31, 2000
Export Citation:
Assignee:
TOKYO ELECTRON LTD
International Classes:
F27B17/00; F27B5/14; F27D1/10; F27D11/02; H01L21/22; (IPC1-7): F27B5/14; F27B17/00; F27D1/10; F27D11/02; H01L21/22
Attorney, Agent or Firm:
Toshio Inoue
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