Title:
熱起動自己整合ヒートシンク
Document Type and Number:
Japanese Patent JP4094505
Kind Code:
B2
Abstract:
A heat-activated self-aligning heat sink is built thermally connecting at least one heat-generating devices on a substrate to the heat sink body, where the heat-generating devices may not be co-planar with each other due to tolerance stack-up or parallel with the heat sink body. A pedestal is attached to the substrate to support the heat sink body. A plug or floating pedestal is placed on top of each heat-generating device and held within the pedestal allowing sufficient movement for the bottom surface of the plug to fully contact the top surface of the heat-generating device. A quantity of a low melting temperature, thermally conductive material, such as solder, or a thermally conductive liquid, is placed over each plug and a heat sink body is placed over the assembly. When heated, the thermal material melts, forming a low impedance thermal junction between the plug and the heat sink body regardless of planarity differences between the two devices.
Inventors:
Brent A Boudrex
Stacy Fraker
Roy M Jehami
Eric Sea Petterson
Christian El Beradi
Stacy Fraker
Roy M Jehami
Eric Sea Petterson
Christian El Beradi
Application Number:
JP2003276764A
Publication Date:
June 04, 2008
Filing Date:
July 18, 2003
Export Citation:
Assignee:
Hewlett-Packard Development Company
International Classes:
H01L23/42; H05K7/20; F28F13/00; H01L21/48
Domestic Patent References:
| JP2002076222A | ||||
| JP2002093962A | ||||
| JP2002093960A | ||||
| JP2001332673A |
Attorney, Agent or Firm:
Masaki Goto
Yoshio Matsuda
Yoshio Matsuda