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Patent Searching and Data


Title:
THERMAL TRANSFER APPLIQUE MATERIAL AND THERMAL TRANSFER APPLIQUE
Document Type and Number:
Japanese Patent JP2010214867
Kind Code:
A
Abstract:

To provide a thermal transfer applique material which is made of such as fabric, knitted fabric and non-woven fabric and a thermal transfer applique material which does not become frayed on the peripheral outline of an applique, and a thermal transfer applique.

The thermal transfer applique material and the thermal transfer applique are obtained by cutting in a desired shape the thermal transfer applique base material which is made of an applique material of a fabric printed in a desired color and desired pattern, and on the heat transfer applique material thinly formed along the outline of the shape or at least along the outline of the shape of the heat transfer applique material, and by transferring the short fibers along the peripheral outline of the applique material surface of the fabric of the heat transfer applique material with the hair transplantation transfer sheet on which a short fiber pattern transfer layer which is made of a short fiber pattern binding film and a short fiber pattern transfer film which perform the edging transfer of short fiber to the desired shape are formed.


Inventors:
AZUMAGUCHI SHIGEJI
NAGAI SHINICHI
Application Number:
JP2009066328A
Publication Date:
September 30, 2010
Filing Date:
March 18, 2009
Export Citation:
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Assignee:
HORAISHA KK
International Classes:
B44C1/17; B44C5/00; D06M17/00
Attorney, Agent or Firm:
Hajime Wada