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Patent Searching and Data


Title:
THERMAL TRANSFER BODY
Document Type and Number:
Japanese Patent JPS6372592
Kind Code:
A
Abstract:

PURPOSE: To prevent a sticking phenomenon, to smoothly perform the movement of a thermal head or paper feed and to eliminate the generation of feed inferiority, by providing a coloring material layer to the single surface of a base film substrate while providing a heat resistant protective layer composed of an inorg. material to the other surface thereof.

CONSTITUTION: A thermal transfer body 4 is formed by providing a coloring material layer 3 to the single surface of a base film substrate 1 and further providing a heat resistant protective layer 3 composed of an inorg. material to the other surface thereof and said protective layer 3 is formed by applying the inorg. material, which is better than the substrate in characteristics such as heat resistance, scratch resistance (hardness), the close adhesiveness with the substrate, conductivity, slidability and heat conductivity etc. As the inorg. material, one or more kind of ZnS, TiO, SiO, SiO2, Al2O3, ZrO2 or MgO is pref. and the thickness of the protective layer is pref. 0.01W10μm, more pref., about 0.1W1μm. When the thickness of the protective layer does not reach 0.01μm, a continuous film is not formed and the desired effect is not obtained.


Inventors:
KAWAZOE SHOZO
AMANO TSUNEYUKI
Application Number:
JP21873386A
Publication Date:
April 02, 1988
Filing Date:
September 17, 1986
Export Citation:
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Assignee:
NITTO ELECTRIC IND CO
International Classes:
B41M5/382; B41M5/40; B41M5/42; (IPC1-7): B41M5/26
Attorney, Agent or Firm:
Hiroshi Ozeki