Title:
マイクロ構造層の熱転写
Document Type and Number:
Japanese Patent JP5814391
Kind Code:
B2
Abstract:
Articles having a component with a surface defining microstructured features can be formed using thermal transfer elements. One example of a suitable thermal transfer element includes a microstructured layer having a surface defining microstructured features imposed on the micro structured layer. The thermal transfer element is configured and arranged for the transfer of at least a portion of the microstructured layer to a receptor while substantially preserving the microstructured features of that portion.
Inventors:
Dave, Mark K.
Wolk, Martin Bee.
Wolk, Martin Bee.
Application Number:
JP2014003094A
Publication Date:
November 17, 2015
Filing Date:
January 10, 2014
Export Citation:
Assignee:
3M INNOVATIVE PROPERTIES COMPANY
International Classes:
B44C1/17; B81C99/00; B41M3/00; B41M5/382; B81C1/00; H01J7/24; H01J9/02; H01L21/48; H01L21/68; B41M5/385; B41M5/40; B41M5/42; H05K3/04
Domestic Patent References:
| JP9311616A | ||||
| JP10208881A | ||||
| JP55121092A | ||||
| JP57193092A | ||||
| JP11142634A |
Foreign References:
| WO1997038865A1 | ||||
| WO1994014619A1 |
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Satoshi Deno
Atsushi Ebiya
Masatoshi Takahashi
Naori Kota
Takashi Ishida
Tetsuji Koga
Satoshi Deno
Atsushi Ebiya
Masatoshi Takahashi
Naori Kota