Title:
熱処理装置及び熱処理方法及び半導体デバイスの製造方法
Document Type and Number:
Japanese Patent JP4355441
Kind Code:
B2
Inventors:
Mikio Tanabe
Miyata Toshimitsu
Swan Wagako
Katsuhisa Kasatsu
Eiji Hosaka
Kenji Ohno
Miyata Toshimitsu
Swan Wagako
Katsuhisa Kasatsu
Eiji Hosaka
Kenji Ohno
Application Number:
JP2000362715A
Publication Date:
November 04, 2009
Filing Date:
November 29, 2000
Export Citation:
Assignee:
Hitachi Kokusai Electric Co., Ltd.
International Classes:
F27D11/02; H01L21/22; H01L21/205
Domestic Patent References:
| JP3032020A | ||||
| JP2000195808A | ||||
| JP6002682U | ||||
| JP9190982A |
Attorney, Agent or Firm:
Shoji Miyoshi