To provide thermal treatment equipment which can efficiently perform heating/cooling treatment by shortening the time required at the time of changing its treating temperature and, at the same time, can guarantee a fixed quality for treated objects.
A heating and cooling device 1 has a temperature control plate 3 set up in a treatment space 3. The semiconductor wafer (W) supporting surface 3a of the plate 3 can be controlled to various treating temperatures. The treatment space 3 is made of a material having a larger coefficient of thermal conductivity than a casing main body 5 has and blocked by means of a soaking section 4 having a small heat capacity. On the outside of the soaking section 4, a heat-insulating section composed of the main body 5 and an air layer 5a between the main body 5 and soaking section 4 is arranged.
KUBOTA KAZUHIKO
YOSHIMITSU TOSHIO
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