Title:
THERMAL TREATMENT EQUIPMENT
Document Type and Number:
Japanese Patent JP2016196966
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To down-size the whole device of thermal treatment equipment, and to reduce a power consumption.SOLUTION: Thermal treatment equipment for performing a heat treatment upon an object 1 in a device body 10 comprises: a cover body 30 of a double wall structure arranged to cover the surrounding of the object 1 and for positioning the object 1 in a first space area 33; an induction heating coil 40 arranged in the device body 10 for heating the object 1 by an induction heating; cooling means for cooling the object 1 by supplying an inert gas to the first space 33; a suction unit 70 for sucking, when driven, the internal air of the second space area 34; an air supply unit 80 for feeding and passing air, when driven, to and through a second space area 34; and a control part 90 for driving the suction unit 70 thereby to stop the air supply unit 80, in the case of heating the object 1, and for driving the air supply unit 80, in the case of cooling the object 1, thereby to perform the drive stop of the suction unit 70.SELECTED DRAWING: Figure 2
Inventors:
YOSHIDA TAKASHI
Application Number:
JP2015076080A
Publication Date:
November 24, 2016
Filing Date:
April 02, 2015
Export Citation:
Assignee:
FUJI ELECTRIC FA COMPONENTS & SYSTEMS CO LTD
International Classes:
F27B5/14; F27B5/06; F27D7/06; F27D11/06
Domestic Patent References:
| JP2013137163A | 2013-07-11 | |||
| JPH09314322A | 1997-12-09 | |||
| JP2009041081A | 2009-02-26 | |||
| JP2001012871A | 2001-01-19 | |||
| JPH01208414A | 1989-08-22 |
Attorney, Agent or Firm:
Hiroaki Sakai