Title:
THERMALLY CONDUCTIVE COMPOSITION AND CURED PRODUCT
Document Type and Number:
Japanese Patent JP2023135162
Kind Code:
A
Abstract:
To provide a thermally conductive composition that can suppress the bleeding of a thermally conductive filler while ensuring thermal conductivity, and a cured product thereof.SOLUTION: A thermally conductive composition contains a polyisocyanate component and a polyol component, and a thermally conductive filler. The polyisocyanate component includes a polyisocyanate with an introduced hydrophilic group.SELECTED DRAWING: None
Inventors:
MORITA YASUSHI
YAJIMA TATSUYA
YAJIMA TATSUYA
Application Number:
JP2022040228A
Publication Date:
September 28, 2023
Filing Date:
March 15, 2022
Export Citation:
Assignee:
MITSUI CHEMICALS INC
International Classes:
C08G18/08; C08G18/42; C08G18/73; C08G18/79
Attorney, Agent or Firm:
Hiroyuki Okamoto
Shinichi Uda
Shinichi Uda