Title:
THERMALLY CONDUCTIVE INSULATING SHEET AND COMPOSITE MEMBER
Document Type and Number:
Japanese Patent JP2021122008
Kind Code:
A
Abstract:
To provide a thermally conductive insulating sheet which can keep high insulating properties after curing.SOLUTION: A thermally conductive insulating sheet contains an uncured product and/or a semi-cured product of a thermally conductive insulating filler (F) and a binder resin (R) that is a thermosetting resin, and has thickness of 25 μm or more. An occupied volume ratio of the thermally conductive insulating filler (F) is more than 40% in 100% of the total volume of the thermally conductive insulating filler (F) and the binder resin (R). When the thickness of the sheet is 80 μm or more, the occupied area ratio of voids existing in a region within 20 μm from both of surfaces of the sheet is 8% or less, and the thickness of the sheet is 25 μm or more and less than 80 μm, the occupied area ratio of voids existing in a region within 10 μm from both of surfaces of the sheet is 8% or less.SELECTED DRAWING: None
Inventors:
SAWAGUCHI JUICHI
TANAKA NAOHIRO
SAKAGUCHI KAORI
KOBAYASHI HIDENORI
TANAKA NAOHIRO
SAKAGUCHI KAORI
KOBAYASHI HIDENORI
Application Number:
JP2021062718A
Publication Date:
August 26, 2021
Filing Date:
April 01, 2021
Export Citation:
Assignee:
TOYO INK SC HOLDINGS CO LTD
TOYOCHEM CO LTD
TOYOCHEM CO LTD
International Classes:
H01B17/56; B32B7/027; C08J9/28; C08K3/013; C08K3/38; C08K7/18; C08L101/00; H01B3/30; H01L23/36
Attorney, Agent or Firm:
Ken Ieiri
Keiko Hata
Keiko Hata