Title:
熱伝導性湿気硬化型樹脂組成物
Document Type and Number:
Japanese Patent JP5828835
Kind Code:
B2
Abstract:
Disclosed is a composition which has high workability, fast curing properties, flexibility and high thermal conductivity. Specifically disclosed is a composition which contains (A) a filler component that contains (A-1) a filler component having an average particle diameter of 0.1-2 µm, (A-2) a filler component having an average particle diameter of 2-20 µm and (A-3) a filler component having an average particle diameter of 20-100 µm, (B) a polyalkylene glycol having a hydrolyzable silyl group, (C) a curing catalyst and (D) a silane coupling agent. The component (A) is a thermally conductive filler having insulating properties, and it is preferable that the cured product of the composition has flexibility. Also specifically disclosed are: a thermally conductive moisture curable resin composition which contains the composition; a heat dissipation member that contains the composition; and a heat dissipation method wherein the heat generated by an electronic component is dissipated to the outside by coating the electronic component with the composition.
Inventors:
Miyazaki Hayato
Kenji Fukao
Keiji Goto
Kenji Fukao
Keiji Goto
Application Number:
JP2012509476A
Publication Date:
December 09, 2015
Filing Date:
March 29, 2011
Export Citation:
Assignee:
Denka Co., Ltd.
International Classes:
C08L71/02; C08K3/00; C08K5/5419; C09D7/65; C09D171/02; C09K5/00
Domestic Patent References:
| JP2002003732A | 2002-01-09 | |||
| JP2005325314A | 2005-11-24 | |||
| JPH06283343A | 1994-10-07 | |||
| JPH05230284A | 1993-09-07 | |||
| JP2000086881A | 2000-03-28 | |||
| JP2005154779A | 2005-06-16 | |||
| JPH0995609A | 1997-04-08 | |||
| JP2010053331A | 2010-03-11 | |||
| JPH0314873A | 1991-01-23 | |||
| JP2000063873A | 2000-02-29 | |||
| JP2006274094A | 2006-10-12 | |||
| JP2001302936A | 2001-10-31 |
Attorney, Agent or Firm:
Masayuki Masabayashi
Hayashi Ichiyoshi
Hayashi Ichiyoshi