Title:
熱伝導性ポリシロキサン組成物
Document Type and Number:
Japanese Patent JP6791672
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a thermally conductive polysiloxane composition which exhibits excellent dry out resistance when thermal stress is applied to the composition.SOLUTION: The thermally conductive polysiloxane composition is provided that includes polyorganosiloxane (A) which has two alkenyl groups in one molecule and one alkoxysilyl group in one molecule and contains an alkoxy group and an alkenyl group, polyorganosiloxane (B) which has one or more alkoxysilyl groups in one molecule and contains an alkoxy group (excluding (A)), polyorganohydrogen siloxane (C) having two hydrogen atoms bonded to a silicon atom in one molecule, a thermally conductive filler (D) and a platinum catalyst (E).SELECTED DRAWING: None
Inventors:
Kenji Takenaka
Masanori Takanashi
Daigo Hirakawa
Isao Iida
Eiji Tanikawa
Masanori Takanashi
Daigo Hirakawa
Isao Iida
Eiji Tanikawa
Application Number:
JP2016144435A
Publication Date:
November 25, 2020
Filing Date:
July 22, 2016
Export Citation:
Assignee:
Momentive Performance Materials Japan LLC
International Classes:
C08L83/07; C08K3/013; C08L83/05; C08L83/06; H01L23/36; H01L23/373; H05K7/20
Domestic Patent References:
| JP2008150439A | ||||
| JP586195A | ||||
| JP9310024A |
Foreign References:
| WO2005030874A1 | ||||
| WO2009066608A1 | ||||
| WO2015155950A1 |
Attorney, Agent or Firm:
Patent business corporation Tsukuni