Title:
熱伝導性シート及びその製造方法、熱伝導性シートの実装方法
Document Type and Number:
Japanese Patent JP6999019
Kind Code:
B2
Abstract:
Provided are a thermally conductive sheet excellent in adhesiveness to an electronic component, handleability and reworkability, a method for manufacturing the same, and a method for mounting a thermally conductive sheet. The sheet includes:a sheet body 2 formed by curing a thermally conductive resin composition containing at least a polymer matrix component and a thermally conductive filler, wherein the volume ratio of the thermally conductive filler to the polymer matrix component is 1.00 to 1.70, the thermally conductive filler contains a fibrous thermally conductive filler 10, and the fibrous thermally conductive filler 10 projects from the surface of the sheet body 2 and is coated with an uncured component of the polymer matrix component.
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Inventors:
Marina Tobata
Aramaki Keisuke
Aramaki Keisuke
Application Number:
JP2020214784A
Publication Date:
January 18, 2022
Filing Date:
December 24, 2020
Export Citation:
Assignee:
Dexerials Co., Ltd.
International Classes:
C08J5/18; C08K7/02; C08L101/00; H01L23/36; H05K7/20
Domestic Patent References:
| JP2010132856A | ||||
| JP2019201225A | ||||
| JP2016092407A | ||||
| JP2008251747A | ||||
| JP2010254766A | ||||
| JP2015029075A | ||||
| JP2015029076A | ||||
| JP2018067581A |
Attorney, Agent or Firm:
Nobuhiro Noguchi
Satoshi Hotani
Satoshi Hotani
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