Title:
熱伝導性シリコーン組成物及びその硬化物
Document Type and Number:
Japanese Patent JP6981914
Kind Code:
B2
Abstract:
[Problem] The present invention is made in the above-mentioned situations, and addresses the problem of providing a silicone composition which has excellent flame retardancy and heat resistance, also has heat conductivity, and can be crosslinked through a hydrosilylation reaction to provide a cured article that has a solid form at room temperature and is softened or liquefied at a high temperature. The present invention also addresses the problem of providing a heat-conductive silicone composition which can be easily applied to a small electronic component and a heatsink. [Solution] A heat-conductive silicone composition containing the following components (A) to (D): (A) an organopolysiloxane represented by average compositional formula (1) and having a kinematic viscosity of 500 to 1,000,000 mm2/s at 25°C, in an amount of 100 parts by mass: (R1 3SiO1/2)a(R1 2SiO2/2)b(R1SiO3/2)c(SiO4/2)d(R2O1/2)e (1) (wherein R1's independently represent a phenyl group, an alkyl or cycloalkyl group having 1 to 6 carbon atoms, an alkenyl group having 2 to 6 carbon atoms, or a hydrogen atom, wherein 50 to 80% of the total number of R1's are phenyl groups, 10 to 20% of the total number of R1's are hydrogen atoms, and 0 to 20% of the total number of R1's are alkenyl groups; R2 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms; and a, b, c, d and e are numerical numbers satisfying the requirements represented by the following formulae: 0 ≤ a ≤ 0.2, 0.2 ≤ b ≤ 0.7, 0.2 ≤ c ≤ 0.6, 0 ≤ d ≤ 0.2, 0 ≤ e ≤ 0.1, and a+b+c+d = 1; (B) a linear organopolysiloxane which has at least two alkenyl groups each having 2 to 6 carbon atoms per molecule, wherein 40 to 70% of the total number of organic groups each bonding to a silicon atom are phenyl groups, in such an amount that the ratio of the number of SiH groups in the component (A) to the total number of alkenyl groups in the components (A) and (B) can become 0.5 to 2; (C) a heat-conductive filler in an amount of 100 to 3500 parts by mass; and (D) a hydrosilylation catalyst. Also provided is a cured article produced by curing the heat-conductive silicone composition.
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Inventors:
Yasumi Hosoda
Application Number:
JP2018074747A
Publication Date:
December 17, 2021
Filing Date:
April 09, 2018
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C08L83/07; C08K3/013; C08L83/05
Domestic Patent References:
| JP2015171767A | ||||
| JP2018056595A | ||||
| JP2015065330A | ||||
| JP2013122037A |
Foreign References:
| WO2011102272A1 |
Attorney, Agent or Firm:
Mitsuo Matsui
Hiroshi Murakami
Yukari Kato
Hidefumi Kawamura
Hiroshi Murakami
Yukari Kato
Hidefumi Kawamura