To provide a thermally conductive silicone gel cured product having good heat conductivity and excellent pot life properties in an uncured state, and excellent in low bleeding after curing.

A low-bleeding, thermally conductive silicone gel cured product is obtained by heat curing of a composition including (A) a branched organopolysiloxane, (B) an organohydrogenpolysiloxane, (C) an addition reaction catalyst, and (D) a thermally conductive filler, wherein the branched organopolysiloxane (A) is represented by formula (1), and has viscosity of 10-100,000 mPa s at 25C; and the organohydrogenpolysiloxane (B) has a unit represented by formula (2) in a molecule.