Title:
超伝導電気カプラを備えた熱絶縁グランド面
Document Type and Number:
Japanese Patent JP7119079
Kind Code:
B2
Abstract:
An integrated circuit is provided that comprises a first ground plane associated with a first set of circuits that have a first operational temperature requirement, and a second ground plane associated with a second set of circuits that have a second operational temperature requirement that is higher than the first operational temperature requirement. The second ground plane is substantially thermally isolated from the first ground plane. A superconducting coupler electrically couples the first ground plane and the second ground plane while maintaining relative thermal isolation between the first ground plane and the second ground plane.
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Inventors:
Ronnie, Patrick Allan
Hathaway, Aaron Ashley
Queen, Daniel Robert
Pushibis, John X.
Young, Robert Miles
Hathaway, Aaron Ashley
Queen, Daniel Robert
Pushibis, John X.
Young, Robert Miles
Application Number:
JP2020517874A
Publication Date:
August 16, 2022
Filing Date:
September 13, 2018
Export Citation:
Assignee:
Northrop Grumman Systems Corporation
International Classes:
H01L23/36; H01L21/822; H01L27/04; H01L39/22; H01R4/68
Domestic Patent References:
| JP10032356A |
Attorney, Agent or Firm:
Makoto Onda
Hironobu Onda
Atsushi Honda
Hironobu Onda
Atsushi Honda