To provide a thermally melt-adhesive sheet for printed circuit boards, having good adhesiveness to metals and substrate resins without causing the sagging of resins on substrates to be adhered and the slippage of adherends even under a high temperature.
Provided is the thermally melt-adhesive sheet for printed circuit boards, formed by molding a graft copolymer obtained by grafting 15 to 40 pts.mass of a graft component (b) to 60 to 85 pts.mass of the following copolymer (a). The copolymer (a) is obtained by copolymerizing (a1) 60 to 95 mass% of a non-polar -olefin or a non-polar conjugated diene with (a2) 5 to 40 mass% of at least one polar monomer selected from the group consisting of ethylenic unsaturated bond-containing carboxylic acids, ethylenic unsaturated bond-containing carboxylic anhydrides, ethylenic unsaturated bond-containing carboxylates, and ethylenic unsaturated bond-containing alcohols. The graft component (b) includes 70 to 95 mass% of a non-polar aromatic monofunctional ethylenic unsaturated monomer (b1) and 5 to 30 mass% of a difunctional ethylenic unsaturated monomer (b2).
YAMADA TOMIO
SONODA KENSAKU
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