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Title:
感熱応答性高分子化合物、並びに該化合物を用いた徐放性生体内分解性医用材料
Document Type and Number:
Japanese Patent JP6888817
Kind Code:
B2
Abstract:
To provide a heat-sensitive responsive polymer that does not induce degradation of heat-sensitive responsiveness even when a structure of the heat-sensitive responsive polymer is modified to control a phase transition temperature.SOLUTION: A heat-sensitive responsive polymer compound according to the present invention is obtained by introducing an oligoethylene glycol chain in at least a part of N-sites of monomer units constituting an N-vinyl amide-based polymer or an N-vinyl amide-based copolymer and is specifically represented by the following general formula (1). (Chemical Formula 1)SELECTED DRAWING: None

Inventors:
Hiroshi Ajiro
Ryo Kawatani
Application Number:
JP2017103673A
Publication Date:
June 16, 2021
Filing Date:
May 25, 2017
Export Citation:
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Assignee:
Nara Institute of Science and Technology
International Classes:
C08F226/02; A61K47/32; A61L31/04; A61L31/14
Domestic Patent References:
JP2008255313A
JP2012102259A
JP10310614A
JP10226715A
JP11322854A
Foreign References:
US20110166308
WO2014208604A1
Attorney, Agent or Firm:
Kyoto International Patent Office