THERMO COMPRESSION BONDING CONNECTION BETWEEN FLEXIBLE SUBSTRATE AND OTHER SUBSTRATES OR THE LIKE

Title:

THERMO COMPRESSION BONDING CONNECTION BETWEEN FLEXIBLE SUBSTRATE AND OTHER SUBSTRATES OR THE LIKE

Document Type and Number:

Japanese Patent JPS61183880

Kind Code:

A

More Like This:

JP2001144142	ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR
JPH05166966	SEMICONDUCTOR DEVICE MOUNTING BOARD
JPS5845824	[Title of the Invention] Electric conduction pattern barrier structure

Inventors:

ARAO YOSHINORI
TANABE HIROSHI
SHIBATA ISAO
TAKAHASHI YOSHIRO

Application Number:

JP2186485A

Publication Date:

August 16, 1986

Filing Date:

February 08, 1985

Export Citation:

Assignee:

OKI ELECTRIC IND CO LTD

International Classes:

H05K3/34; (IPC1-7): H01R9/09

Domestic Patent References:

JPS5583292A	1980-06-23
JPS5755974B2	1982-11-27

Attorney, Agent or Firm:

Takaji Kanakura

Previous Patent: JPS61183879

Next Patent: PRINTED CIRCUIT BOARD CONNECTING TERMINAL HAVING INTEGRAL GROUND SURFACE