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Title:
Thermocompression bonding apparatus
Document Type and Number:
Japanese Patent JP6221059
Kind Code:
B2
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Inventors:
Toru Takahashi
Yasutaka Tsuboi
Hiroshi Uchiyama
Tomotaka Nishimoto
Application Number:
JP2013209855A
Publication Date:
November 01, 2017
Filing Date:
October 07, 2013
Export Citation:
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Assignee:
Panasonic IP Management Co., Ltd.
International Classes:
H01L21/52; H01L21/60; H01L21/603; H05K3/32
Domestic Patent References:
JP2003124698A
JP200447862A
JP2008103513A
JP2013122988A
JP201576536A
Attorney, Agent or Firm:
Kenji Kamada
Hiroo Maeda



 
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