To provide a thermocompression bonding device which enhances manufacturing workability, reduces a manufacturing cost and eliminates strains in two substrates of the glass substrates stuck together for a liquid crystal panel.

An empty cell 10 is arranged between a metallic upper plate 6 and a metallic lower plate 7. This empty cell 10 is placed on a pressure receiving side sheet 11 and a pressurization side sheet 9 is also placed on the empty cell 10. Air is put into the sheet 9 to expand and pressurize the empty cell 10. Compression bonding tools 1 are arranged in a heat treatment apparatus 3c in such a pressurized state. The respective tools 1 are stacked through spacers 4 disposed at their ends and further heating means for subjecting the respective tools 1 to a hot air treatment are provided.