To provide a thermoelectric apparatus that attains improvement in heat-absorption efficiency and heat-dissipation efficiency, by reducing the thermal resistance from a heat source to a thermoelectric device and that of from the thermoelectric device to a heat-dissipation member, while attaining improvement in reliability by preventing breakage of a thermoelectric module by adopting a structure that relieves thermal stresses.
The thermoelectric apparatus 10 is configured as follows; a heat-dissipation side heat exchanger 11 is joined to the face opposite to the face, on which each thermoelectric device 17 of a heat-dissipation side electrode 13 is jointed, via a first insulation resin layer 12 having high-heat conductivity; a heat-absorption side heat exchanger 14 is jointed to the face opposite to the face, on which each thermoelectric device 17 of a heat-absorption side electrode 16 is jointed via a second insulation resin layer 15 having high-heat conductivity. The first insulation resin layer 12 is formed with each gap-penetrating through the first resin layer. Each groove part 11b is formed in each surface portion which corresponds to each gap of the heat-dissipation side heat exchanger 11.
Yasuo Asami
Hideo Takahashi
Yoshitaka Takeyama
Eiichi Sobue