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Title:
THERMOELECTRIC CONVERSION MODULE
Document Type and Number:
Japanese Patent JPH07153998
Kind Code:
A
Abstract:

PURPOSE: To obtain a thermoelectric conversion module and a device having little heat source loss, a small and long element leg between both tips of the high- and-low heat sources.

CONSTITUTION: A metal ring 23 is inserted into the inner peripheral side of a ring-shaped insulated plate. Semicircular n-type and p-type semiconductor thick film elements 26, 27 are opposedly provided on a substrate 21 where a metal ring 23 is fitted into the innerperipheral side of a ring-shaped insulated plate 22 and a columnar conductor 24 is inserted near the outer peripheral edge in order to detect a potential difference generated on these two semiconductor elements by heating or cooling the metal ring. Potential of one semiconductor thick film element is taken out from the other end of the columnar conductor and potential of the other semiconductor thick film element is taken out from its surface so as to be detected. Further, when a plurality of modules are laminated and linear hot-stream storage containers are inserted into a plurality of metal links to flow hot fluid, a thermoelectric conversion device able to take out potential from the substrates of the upper and lower ends can be obtained.


Inventors:
TANJI YASUNORI
MASUMOTO TAKESHI
KANEKO TAKEJIRO
Application Number:
JP29687393A
Publication Date:
June 16, 1995
Filing Date:
November 26, 1993
Export Citation:
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Assignee:
TOKIN CORP
MASUMOTO TAKESHI
International Classes:
H01L35/32; (IPC1-7): H01L35/32
Attorney, Agent or Firm:
Yosuke Goto (3 outside)



 
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