Title:
THERMOELECTRIC MODULE
Document Type and Number:
Japanese Patent JP2015056507
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a highly reliable thermoelectric module reduced in thermal stress generation and stable in structure.SOLUTION: A thermoelectric module comprises: a high temperature side base plate and a low temperature side base plate disposed opposite each other; a plurality of semiconductor elements stretched between the high and low temperature side base plates; and a plurality of wires arranged on the opposite faces of the high and low temperature side base plates, and having a plurality of wires for electrically connecting the semiconductor elements in series. All the semiconductor elements are electrically connected to wires arranged in layers on the high temperature side base plate via a liquid metal, and are electrically connected to wires arranged in layers on the low temperature side base plate via a solid metal. It is preferable that the high temperature side base plate and low temperature side base plate be connected. It is preferable that at least part of the semiconductor element side of the wires arranged in layers on the high temperature side base plate have a recessed part that is able to hold the liquid metal.
Inventors:
HAYASHI TAKAHIRO
Application Number:
JP2013188888A
Publication Date:
March 23, 2015
Filing Date:
September 11, 2013
Export Citation:
Assignee:
YAMAHA CORP
International Classes:
H01L35/08; H01L25/11; H01L35/32; H02N11/00
Attorney, Agent or Firm:
Kazuki Amano
Koji Ishida
Koju Kagami
Koji Ishida
Koju Kagami
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