To provide a thermoelectric semiconductor material, together with its manufacturing method, which is better in mechanical strength than conventional one.
A dust body of solid solution powder of thermoelectric semiconductor material is forcedly worked by hot extrusion or hot rolling, or, when hot extrusion or hot rolling is performed, a surface layer is fusion-coagulated, so that a sintered body where a surface enhanced layer is formed at a surface layer part is obtained. In addition, a sintered body is obtained wherein a material for an enhanced layer comprising ceramics or low melting-point glass is formed as a surface enhanced layer, at the surface layer part, by hot extrusion or hot rolling. Thus, a thermoelectric semiconductor material, better than before in strength, such as electronic cooling element, thermal power generation element, etc., is provided.
HACHISUGA JOJI
HORI SATOSHI
YAMAZAKI MAKOTO
ANDO MASAYOSHI
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