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Patent Searching and Data


Title:
THERMOELEMENT ARRAY
Document Type and Number:
Japanese Patent JPH07169995
Kind Code:
A
Abstract:

PURPOSE: To obtain a thermoelement array which can provide a high electromotive force in a small area and facilitate assembling, by arranging a plurality of layer-built thermoelements in which a pair and more of p type semiconductors and n type semiconductors, are piled up, in such a way that high-temperature ends are lined up on the same plane and mutually connected electrically.

CONSTITUTION: Nine layer-built thermoelements 1 in which size pairs of a p type semiconductors and n type semiconductors, 30mm long, 6mm wide, and 5mm thick, are formed, are used. Each thermoelement 1 generates an electromotive foce of over 1.5V by a temperature difference of 600°C. The high temperature ends of these thermoelements are fixed by alumina element to a 0.6mm thick alumina substrate 10, at an approx. 5mm pitch, in 3×3 arrangement. Respective elements are connected in series electrically by soldering lead wires. This enables a high output thermoelement array of the same dimensions to be obtained easily as compared with the conventional one.


Inventors:
IIZUKA HIROYUKI
YAMAZAKI TAKUYA
Application Number:
JP31666393A
Publication Date:
July 04, 1995
Filing Date:
December 16, 1993
Export Citation:
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Assignee:
MITSUBISHI MATERIALS CORP
International Classes:
H01L35/32; (IPC1-7): H01L35/32
Attorney, Agent or Firm:
Yoshio Kosugi (2 outside)