To solve such problems that a skeleton-type thermoelement among thermoelements for realizing electronic cooling is used to reduce the warpage or deformation of a substrate due to thermal expansion, but it has still ununiformity of height and mass-productivity.

The thermoelement is comprised of a p-type thermoelectric material, an n-type thermoelectric material, a metallic electrode wherein the p-type and n-type thermoelectric materials are joined as being pinched, and an endothermic side substrate and a heat dissipation side substrate wherein the metallic electrodes are formed. Either or both of the endothermic and heat dissipation substrates are divided into plural pieces, and the divided substrates are provided with a plurality of electrodes, wherein the p-type and n-type thermoelectric materials form plural pairs of pn junctions by joining them through pn junction by means of the electrodes.