To obtain an adhesive which enables repair work when thermally melted and has remarkably improved resistances to heat and moisture by compounding a polyolefin resin having a specified water absorption with a polyamide resin having a specified m.p. in a specified wt. ratio.
30-70 pts.wt. polyolefin resin having a water absorption of 0.01% or lower and sol. in an og. solvent is compounded with 70-30 pts.wt. polyamide resin having an m.p. of 170-200°C. A thermoplastic conductive adhesive in the form of a film can be produced by dissolving a polyolefin resin in xylene, mixing the resultant soln. with microencapsulated filler comprising silver particles coated with an insulating resin, applying the resultant mixture to a Mylar film by a doctor blade method, heating thus formed film to 50°C to evaporate xylene and to cause the filler to settle, and heating the film to 140°C to completely evaporate xylene.
HOZUMI YUUKO
DATE HITOAKI
USUI MAKOTO
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