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Title:
THERMOPLASTIC COMPOSITE MATERIAL FOR STRUCTURE
Document Type and Number:
Japanese Patent JPH021303
Kind Code:
A
Abstract:

PURPOSE: To obtain a composite material excellent in machining precision by a method wherein an adhesive layer obtained by laminating an amorphous polymer having a glass transition temperature lower by 10°C than the melting point of a polymer of a first layer is applied to the first layer constituted of a fiber-reinforced thermoformable polymer composite material containing reinforcing filaments.

CONSTITUTION: Polyester, polyamide, polypropylene or the like is adopted as a polymer of a first layer of a laminate containing reinforcing fibers comprising carbon fibers or the like about 10-50 mm long. For an adhesive layer of the laminate, a polymer having a melting point or a glass transition point lower than the melting point of the crystalline polymer of the first layer is used. Herein the polymer of the first layer is blended in the adhesive layer for effecting transfer of the fibers into the adhesive layer at the time when a composite material is subjected to pressing, and thereby the composite material is homogenized.


Inventors:
FUREDERITSUKU NEIRU KOTSUGUSUU
PIITAA JIEEMUZU MIIKIN
Application Number:
JP31023788A
Publication Date:
January 05, 1990
Filing Date:
December 09, 1988
Export Citation:
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Assignee:
ICI PLC
International Classes:
B29C65/00; B29C70/08; B29C73/02; B32B3/12; B32B5/10; B29C70/06; B32B5/12; B32B5/28; C08J5/04; C08J5/24; (IPC1-7): B29C67/14; B29C73/02; B32B3/12; B32B5/12; B32B5/28
Attorney, Agent or Firm:
Aoki Akira (3 outside)



 
Next Patent: JPH021304