THERMOPLASTIC RESIN COMPOSITE, AND COMPOSITE STRUCTURE THEREOF AS WELL AS MONOLITHICALLY MOLDED ARTICLE BY USING IT

Title:

THERMOPLASTIC RESIN COMPOSITE, AND COMPOSITE STRUCTURE THEREOF AS WELL AS MONOLITHICALLY MOLDED ARTICLE BY USING IT

Document Type and Number:

Japanese Patent JP2007254718

Kind Code:

A

Abstract:

To provide a thermoplastic resin structure excellent in the flame retardancy; a composite structure excellent in the joining property to different kinds of materials; and a monolithically molded article thereof.

The thermoplastic resin composite (I) comprising (A) a thermoplastic resin matrix layer and (B) a thermoplastic resin fiber in the form of a filament aggregate which the filaments are assembled, is characterized in that the thermoplastic resin composite (I) has a total thickness-t of 5-500 μm, and satisfies the relationship: Lb>La, and besides Lb is 25 or more, wherein La is a limit oxygen index (LOI) of the thermoplastic resin constituting the thermoplastic resin matrix layer (A) and Lb is a limit oxygen index (LOI) of a thermoplastic resin constituting the thermoplastic resin fiber (B).

Inventors:

TSUCHIYA ATSUKI
HONMA MASATO
FUJIOKA SEI

Application Number:

JP2007033013A

Publication Date:

October 04, 2007

Filing Date:

February 14, 2007

Export Citation:

Click for automatic bibliography generation Help

Assignee:

TORAY INDUSTRIES

International Classes:

C08J5/04; B32B5/28; B32B27/12; C08L101/00

Domestic Patent References:

JPH03119035A	1991-05-21
JP2001044584A	2001-02-16
JP2003014086A	2003-01-15
JP2004345102A	2004-12-09
JP2006001959A	2006-01-05

Foreign References:

WO2004068059A1

2004-08-12

Previous Patent: LIQUID CRYSTALLINE RESIN COMPOSITION AND MOLDED ARTICLE CONSISTING OF THE SAME

Next Patent: BASE MATERIAL FOR THERMAL ADHESION