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Title:
THERMOPLASTIC RESIN COMPOSITION EXCELLENT IN LIGHT DIFFUSIBLE AND ITS MOLDED ITEM
Document Type and Number:
Japanese Patent JP2000169721
Kind Code:
A
Abstract:

To obtain a thermoplastic resin composition which is excellent in light transmission properties and light diffusibility and gives a molded item having a good external appearance by compounding a transparent thermoplastic resin with silicone particles prepared by coating specific spherical silicone rubber particles with a polyorganosilsesquioxane resin.

This composition is prepared by compounding a transparent thermoplastic resin, preferably a methacrylic or MS resin, with silicone particles prepared by coating spherical silicone rubber particles having an average particle size of 0.1-50 μm with a polyorganosilsesquioxane resin preferably in an amount of 0.5-500 wt.% of the rubber particles. Preferably, the amount of the silicone particles in the composition is 0.0003-30 wt.%. The composition is injection molded to give a light-diffusible molding or a light-diffusible sheet, those products being useful for lighting applications.


Inventors:
SAKURABA KENJI
Application Number:
JP34340398A
Publication Date:
June 20, 2000
Filing Date:
December 02, 1998
Export Citation:
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Assignee:
ASAHI CHEMICAL IND
International Classes:
C08J3/12; B29C45/00; B29C47/00; C08L25/14; C08L33/10; C08L83/04; C08L101/00; F21V1/22; F21V3/04; G02B5/02; (IPC1-7): C08L101/00; B29C45/00; B29C47/00; C08L25/14; C08L33/10; C08L83/04; G02B5/02