THERMOPLASTIC RESIN COMPOSITION FOR FOAMING AND FOAM- MOLDED PRODUCT

Japanese Patent JP3789254

B2

PROBLEM TO BE SOLVED: To obtain a thermoplastic resin composition for foaming, capable of allowing the expansion ratio to be readily increased, and capable of providing a foam-molded product excellent in surface nature and flexibility of the molded product. SOLUTION: This thermoplastic resin composition for foaming is obtained by adding (B) 0.1-15 pts.wt. chemical foaming agent and (C) 0.1-20 pts.wt. high molecular weight resin composition to (A) 100 pts.wt. flexible resin composition comprising (a) a (meth)acrylic ester-based copolymer having ≤20°C glass transition temperature and ≤40 wt.% gel content, (b) a copolymer having ≥50°C glass transition temperature and (c) 0-70 pts.wt. graft copolymer, and having 30-100 hardness measured by the method of JIS K6301 at 20°C. The foam-molded product is obtained therefrom.

WO/2004/094512	CONDUCTIVE FOAMED MATERIAL AND PROCESS FOR PRODUCING THE SAME
WO/2012/141291	FOAM COMPOSITION FOR FILLING/SEALING PURPOSES, FOAM MEMBER FOR FILLING/SEALING PURPOSES, AND FOAM BODY FOR FILLING/SEALING PURPOSES
JP7413766	Paste vinyl chloride resin

Kazuhito Wada
Ikuhiro Mishima
Hiroshi Ishii

JP11641599A

June 21, 2006

April 23, 1999

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Kaneka Corporation

C08J9/06; C08L33/06; C08L51/04; C08L55/02; (IPC1-7): C08J9/06; C08L33/06; C08L51/04; C08L55/02

JP2184418A
JP2000302937A
JP2000186181A
JP2000169656A
JP11335507A
JP58179257A
JP63017954A
JP8027336A

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