Title:
THERMOPLASTIC RESIN COMPOSITION FOR MEMORY CARD, ITS MANUFACTURING METHOD AND MEMORY CARD
Document Type and Number:
Japanese Patent JP3969006
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a thermoplastic resin composition for a memory card exhibiting excellent fluidity, capable of finely molding a thin-wall part and yet excellent in heat resistance and impact resistance.
SOLUTION: The thermoplastic resin composition for a memory card is prepared by compounding (A) a polycarbonate resin, (B) an ABS resin, (C) a graft copolymer comprising a polycarbonate resin segment (a) and a vinyl resin segment (b) chemically bonded thereto to give a branched or crosslinked structure, (D) a crystalline resin and (E) a crystalline nucleating agent. This resin composition has fluidity excellent enough to permit to finely mold a thin- wall part to give a memory card. This resin composition can give a memory card having a high heat distortion temperature and excellent in heat resistance and also in impact strength.
Inventors:
Hiroshi Yamamoto
Masaaki Otsu
Masaaki Otsu
Application Number:
JP2001076676A
Publication Date:
August 29, 2007
Filing Date:
March 16, 2001
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS,LTD.
International Classes:
B42D15/10; C08L69/00; C08F283/02; C08J3/20; C08K3/00; C08L55/02; G06K19/02; G06K19/077; (IPC1-7): C08L69/00; B42D15/10; C08F283/02; C08J3/20; C08K3/00; C08L55/02; G06K19/077; //(C08L69/00; C08L55:02; C08L51:08; C08L101:00); (C08L55/02; C08L69:00; C08L51:08; C08L101:00)
Domestic Patent References:
| JP11199747A | ||||
| JP2000080263A | ||||
| JP1130994A | ||||
| JP11001607A | ||||
| JP4120172A | ||||
| JP2041357A |
Attorney, Agent or Firm:
Keisei Nishikawa
Atsuo Mori
Atsuo Mori
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