Title:
THERMOPLASTIC RESIN COMPOSITION AND MOLDED PRODUCT COMPOSED OF THE SAME COMPOSITION
Document Type and Number:
Japanese Patent JP2005146152
Kind Code:
A
Abstract:
To obtain a resin composition excellent in flame-retardant effect, having good flexibility and softness and excellent in tensile physical properties, and to provide its molded product, particularly an insulator and/or sheath of an electric wire.
The thermoplastic resin composition comprises (A) 20-64.9 wt.% ethylenic polymer composition containing (A-1) ethylene-α-olefin copolymer having (i) 0.857-0.890 g/cm3 density, (ii) 0.1-1.5 g/10 min melt flow rate (MFR) in 2.16 kg load at 190°C and (iii) 1.5-3.5 index (Mw/Mn) of molecular weight distribution evaluated by GPC method and (A-2) an ethylene-based polymer other than (A-1) in a weight ratio of (20/80) to (100/0), (B) 35-70 wt.% metal hydroxide and (C) 0.1-20 wt.% zinc compound.
Inventors:
UEHARA KAN
YAMAGUCHI MASAYOSHI
KAWACHI HIDESHI
YAMAGUCHI MASAYOSHI
KAWACHI HIDESHI
Application Number:
JP2003387111A
Publication Date:
June 09, 2005
Filing Date:
November 17, 2003
Export Citation:
Assignee:
MITSUI CHEMICALS INC
International Classes:
C08L23/04; C08K3/10; H01B3/00; H01B3/44; H01B7/295; (IPC1-7): C08L23/04; C08K3/10; H01B3/00; H01B3/44
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