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Title:
THERMOPLASTIC RESIN COMPOSITION AND MOLDED PRODUCTS OF THE SAME
Document Type and Number:
Japanese Patent JP2003160699
Kind Code:
A
Abstract:

To provide a thermoplastic resin composition capable of molding molded products having embrittlement resistance at a low temperature, balanced properties of tensile elongation and tensile fracture point strength and excellent mar resistance, also to provide molded products of the same.

The thermoplastic resin composition comprises 20-60 wt.% of a practically random inter polymer such as an ethylene-styrene copolymer consisting of 1-99 mol% of a polymer unit derived from an aromatic vinyl or vinylidene monomer, and/or a hindered aliphatic or a cyclic aliphatic vinyl or vinylidene monomer and 1-99 mol% of a polymer unit derived from one or more kinds of a 2-20C α-olefin (A) and 40-60 wt.% of at least 2 kinds of magnesium hydroxide (B). The inter polymer (A) can be silanegrafted.


Inventors:
UEHARA KAN
KIMURA TOMOHIKO
MORIYA SATORU
Application Number:
JP2001362773A
Publication Date:
June 03, 2003
Filing Date:
November 28, 2001
Export Citation:
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Assignee:
MITSUI CHEMICALS INC
International Classes:
C08J5/00; C08K3/22; C08L23/00; C08L25/02; (IPC1-7): C08L23/00; C08J5/00; C08K3/22; C08L25/02
Attorney, Agent or Firm:
Shunichiro Suzuki (1 person outside)